What is Team Vegapod Hyperloop?
Team Vegapod Hyperloop is a student-led research and engineering team based at MIT World Peace University, formed in 2018. It composed of ~40 multidisciplinary students from mechanical, electrical, electronics, management background. It is focused on designing sub-scale hyperloop prototypes incorporating levitation systems, vacuum compatibility, contactless propulsion, regenerative braking, power electronics, and cooling systems. advancing hyperloop technology through prototype design, development, and international competitions.
Mission: Accelerate sustainable, ultra-fast transportation concepts (Hyperloop) and showcase India’s engineering talent on the global stage.
They participate in:
● European Hyperloop Week (EHW) – Premier annual global hub for hyperloop research, demonstrations, workshops, and prototype showcases.
● Canadian Hyperloop Conference – where they showcased prototypes and contributed technical insights.
Contribution of Mentor
Dr. Ganesh Marotrao Kakandikar has made significant contributions to the Vegapod student team as a faculty mentor, providing continuous technical guidance, academic mentorship, and strategic oversight. His involvement has helped students translate engineering theory into practical, competition-ready solutions through structured design reviews, system-level thinking, and sound manufacturing practices. Dr. Kakandikar has played a key role in strengthening the team’s project planning, documentation standards, and compliance with technical and safety requirements for national and international events. Beyond technical mentoring, he has actively supported Vegapod by facilitating industry interactions, research exposure, and institutional backing. Notably, his efforts have contributed to securing CSR (Corporate Social Responsibility) support, enabling access to critical resources, infrastructure, and financial assistance essential for advanced prototyping and project execution. Drawing from his expertise in CAD/CAE, manufacturing, innovation, and research publishing, he has helped build a sustainable, research-oriented, and professionally driven culture within the team, empowering students to develop leadership skills, engineering confidence, and global competitiveness.
Participation and Achievements
2021 – The Netherlands
European Hyperloop Week
Achievement- Represented India at European Hyperloop Week with strong prototype demonstration and
engineering documentation
2022 – Canada & The Netherlands
Canadian Hyperloop Conference & EHW prototype showcase
Achievement- Canadian Hyperloop Conference showcase prototype.
EHW (Netherlands) — developed cost-efficient operational pod.
2023 – United Kingdom
European Hyperloop Week, University of Edinburgh
Achievement- Achieved Top 6 globally at EHW Edinburgh. Only Asian team to clear Testing & Safety Documentation round. Built a 100% sustainable prototype with in-house PSIM inverter and LIM.
2024 – Switzerland
European Hyperloop Week at ETH Zurich
Achievement- Top 2 in mechanical, electrical & guidance subsystems. Won Outreach Award for global promotion of hyperloop tech. Achieved static levitation and advanced thermal management, improving pod stability and efficiency.
2025 – The Netherlands
European Hyperloop Week, Groningen/Veendam
Achievement- 8th place globally, Top-2 in showcase/outreach categories. Demonstrated upgraded pod with dual LIMs, EMS levitation, eco-friendly structural materials (flax & coconut fiber).
Grants Received
2023 – Till date
| Sr. No. | Company Name | Type | Description | Amount (₹) |
|---|---|---|---|---|
| 1 | SB Electronics | PCBs | In-Kind | 37,500 |
| 2 | Prototech | MVCU | In-Kind | 35,500 |
| 3 | Gatkul Automotive | Aeroshell Manufacturing | In-Kind | 40,000 |
| 4 | Definitive Detailing | Aeroshell Powder Coating and Livery | In-Kind | 60,000 |
| 5 | SWISS Airlines | Travel Tickets | In-Kind | 15,00,000 |
| 6 | MAHLE Engineering | CSR Funds | Monetary | 2,80,000 |
| 7 | Infineon Technologies | CSR Funds | Monetary | 5,00,000 |
| 8 | Yashi Wraplts | Shipping Crate | Monetary | 18,000 |
| 9 | Precision Wires | Levitation & LIM – Copper Wires | In-Kind | 70,000 |
| 10 | Bender | IMD | In-Kind | 60,000 |
| 11 | POLYCAB | Insulation Wires | In-Kind | 10,000 |
| 12 | ST Microelectronics | Development Boards | In-Kind | 35,975 |
| 13 | XPS | Fasteners | In-Kind | 85,049.92 |
| 14 | Norbar Torque Tools | Torque Tools | In-Kind | 63,472.28 |
| 15 | Epitome Components | PCBs | In-Kind | 1,50,000 |
| 16 | HILTI | Power Tools | In-Kind | 2,65,993 |
| 17 | Traco Power | DC-DC Converter | In-Kind | 2,15,000 |
| 18 | Total Phase | CAN Interface | In-Kind | 52,660 |
| 19 | SENIS AG | Current Sensors | In-Kind | 1,65,000 |
| 20 | Rosenberger | EVHV Connectors | In-Kind | 30,000 |
| 21 | JBC | Soldering Station | In-Kind | 54,600 |
| 22 | Analog Devices | ICs & IGBTs | In-Kind | 30,000 |
| 23 | TE Connectivity | Electrical Components | In-Kind | 60,000 |
| 24 | TDK | Contactors & Capacitors | In-Kind | 65,903 |
| 25 | Vicharak | FPGA Development Board | In-Kind | 16,000 |
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